Origin Modeling And Suppression Of Grinding Marks In Ultra Precision Grinding Of Silicon Wafers - search results
Zhichao(Zinc) Li - Google Scholar
Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers FW Huo, RK Kang, Z Li, DM Guo International Journal of Machine Tools and Manufacture 66, 54-65, …
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---- Origin, …
： A phenomenon commonly encountered in grinding of silicon wafers is the grinding marks, which are difficult to remove by subsequent polishing process, and have been a great obstacle to the manufacture of silicon wafers with higher flatness. In this paper, the grinding marks formation mechanism was clarified, a grinding marks formation ...
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PDF Principles Of Abrasive Processing Download Full – PDF ...
Every aspect of the grinding process--techniques, machines and machine design, process control, and productivity optimization aspects--come under the searchlight. The new edition is an extensive revision and expansion of the first edition covering all the latest developments, including center-less grinding and ultra-precision grinding.
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Curvature effect on surface topography and uniform scallop ...
High-precision optical components with complex shapes or microstructures have been extensively used in numerous fields such as biomedicine, energy and aerospace. In order to accurately achieve the specific functions of the components, the form accuracy and uniform surface quality need to reach an ever-high level. To achieve this, ultra-precision normal grinding is used for machining various ...
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Micromachines | Special Issue : Ultra Precision ...
The air bearing motorized spindle (ABMS) is the key component of the ultra-precision machine tool, which plays an important role in the ultra-precision machining process and directly influences machining accuracy. The influence of unbalanced magnetic force (UMF) on the nonlinear dynamic behavior of the ABMS is not understood clearly.
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Industrial Engineering Knowledge Center: Surface Grinding ...
Modeling of Vibration Condition in Flat Surface Grinding Process › journals by A Gasagara - 2020 Feb 10, 2020 - This article presents a new model of the flat surface grinding process vibration conditions.
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CIRP
Keywords: Ultra-precision, Grinding, Chemical action assistance : Abstract : Higher accuracy and more efficient production of large aperture glass lenses is increasingly required for high-resolution imaging devices. These glass lenses are typically manufactured by both ultra-precision grinding and polishing.
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Abstract - OSA | OSA Publishing
High-precision optical components with complex shapes or microstructures have been extensively used in numerous fields such as biomedicine, energy and aerospace. In order to accurately achieve the specific functions of the components, the form accuracy and uniform surface quality need to reach an ever-high level. To achieve this, ultra-precision normal grinding is used for machining …
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Affecting factors, optimization, and suppression of ...
Zurück zum Zitat Huo F, Kang R, Li Z, Guo D (2013) Origin, modeling and suppression of grinding marks in ultra-precision grinding of silicon wafers. Int J Mach Tool Manu 66:54–65. https:// doi. org/ 10. 1016/ j. ijmachtools. 2012. 11.
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Grinding marks on ultra-precision grinding spherical and ...
Grinding marks are regard as a great obstacle to manufacture spherical and aspheric surfaces with higher surface quality, lower energy and wastage. The scallop-height was studied for optimizing the grinding parameters firstly to reduce its effect on grinding marks. Secondly, the expression of grinding points distribution was established to characterize the grinding marks …
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Wafer Thinning Process and Its Critical Manufacturability ...
to attain thinning wafer or silicon wafers an ultra-precision grinding machine [1] should carry it out. Nowadays, several issues and requirements are encountered during proliferation from development to the manufacturing phase. The paper will discuss the several key process requirements to attain stress-free wafer thinning
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(PDF) Ultraprecision ductile mode machining of glass by ...
An experimental investigation into micro ball end-milling of silicon. By Muhammad Arif Rahman. Analytical modeling of ductile-regime machining of tungsten carbide by endmilling. By Muhammad Arif. A review on the current research trends in ductile regime machining. By M. Rahman and dennis Neo.
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Chemical Mechanical Polishing of Silicon Wafers: Finite ...
Silicon is the primary semiconductor material used to fabricate integrated circuits. The quality of microchips depends directly on the quality of silicon wafers. A series of processes are required to manufacture the high-quality silicon wafers. Chemical mechanical polishing is a necessary step to achieve the required wafer flatness.
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The effect of the chuck shape on the wafer topography in ...
Advances in Mechanical Engineering, Volume 13, Issue 10, October 2021.
Back Grinding of Wafer with Outer Rim (BGWOR) is a novel method for carrier-less thinning of silicon wafers. Silicon wafers are widely used in integrated circuits (ICs). The...
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[PDF] Fine grinding of silicon wafers: effects of chuck ...
Silicon wafers are used for production of most microchips. Various processes are needed to transfer a silicon ingot into wafers. With continuing shrinkage of feature sizes of microchips, more stringent requirement is imposed on wafer flatness. Fine grinding of silicon wafers is a patented technology to produce super flat wafers at a low cost.
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19. D.M. Guo, F. Ren, Y.W. Sun. An approach to modeling cutting forces in five-axis ball-end milling of curved geometries based on tool motion analysis. ASME Transaction：Journal of Manufacturing Science and Engineering, 2010, 132(4): 041004-041004-8. ... D.M. Guo. Origin, modeling and suppression of grinding marks in ultra precision grinding ...
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Origin, modeling and suppression of grinding marks in ...
Highlights Grinding marks on silicon wafers are caused by the axial run out of the cup wheel. Grinding marks present multiple angular wavelengths characteristics. A grinding marks formation model was developed. An angular wavelength model of the grinding marks was developed. Grinding marks can be suppressed by reducing the cutting paths aggregation.
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KURODA HISTORY 90 | Kuroda Precision Industries Ltd.
Kuroda Precision Industries ltd. KURODA HISTORY 90 information. Kuroda Precision Industries is manufacturer of precision equipments and machines of Japan. We manufacture such as Precision Ball Screws,Ballscrew Actuators,Press Tools,Surface Grinding Machine,Gauges,Ultra Precision Surface Configuration Measuring systems and etc.
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Prof. Tony B. Hull Profile
Search the leading research in optics and photonics applied research from SPIE journals, conference proceedings and presentations, and eBooks
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Deformation and removal of semiconductor and laser single ...
Huo F W, Kang R K, Li Z and Guo D M 2013 Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers Int. J. Mach. Tool Manuf. 66 54–65 Crossref Google Scholar [158]
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Origin, modeling and suppression of grinding marks in ...
Request PDF | On Mar 1, 2013, F.W. Huo and others published Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers | Find, read and cite all the research ...
ادامه مطلبOrigin, modeling and suppression of grinding marks in ...
Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers A phenomenon commonly encountered in grinding of silicon wafers is the grinding marks, which are difficult to remove by subsequent polishing process, and have been a great obstacle to the manufacture of silicon wafers with higher flatness.
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Advances in X-Ray/EUV Optics and Components III | (2008 ...
Recently the design of a Laue lens with field of view of 30 arcseconds and for x-rays in the energy range from 100 keV to 1 MeV has been proposed in which mosaic crystals are used as focussing elements. The proper mosaic angular spread is chosen as a compromise between intensity and energy resolution of …
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Grinding Marks in Back Grinding of Wafer with Outer Rim ...
Huo, FW, Kang, RK, Li, Z, et al. Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers. Int J Mach Tools Manuf 2013; 66: 54 – 65. Google Scholar | Crossref
ادامه مطلبAnalytical Elastic–Plastic Cutting Model for Predicting ...
When the existing analytical models are used to predict the gain depth-of-cut in ultra-precision grinding process of silicon wafer, the results obtained become unreasonable due to an extremely shallow grain depth-of-cut, which is inconsistent with the theory of the contact mechanics.
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Grinding | Fracture | Dislocation
The grinding technology for advanced materials such as optical glass, WC, ceramics and silicon has substantially grown with the widespread use of precision components made of such materials in various applications like micro lenses, semiconductor components, automobile diesel injectors, and magnetic heads for computers etc. Applications of ...
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Two-dimensional extreme distribution for estimating ...
Abstract: The effective estimation of the operational reliability of mechanism is a significant challenge in engineering practices, especially when the variance of uncertain factors becomes large. Addressing this challenge, a novel mechanism reliability method via a two-dimensional extreme distribution is …
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ODF'20
An advanced polishing technique of ion polishing has been used to process silicon wafers. This high-level stability and the precision process can achieve the roughness Ra 0.231nm at the finishing optical surfaces. Preview abstract
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Transactions of the JSME (in Japanese)
This phenomenon, which is typical in turbomachinery, is referred to as ice shedding. The ice shedding phenomenon is very complicated because there are several unknown physical properties of ice, such as the ice density, the adhesion force between accreted ice …
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CIRP
Study of the effects of laser micro structuring on grinding of silicon nitride ceramics: Bahman Azarhoushang, Babak Soltani, Amir Daneshi / Goverdham D. Lahoti (1) STC G, 67/1/2018, P.329 : Keywords: Laser assisted grinding, Silicon nitride, Specific grinding energy, Ultra-short pulsed laser, Laser energy, Single grain cutting
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